
6
Technical Data
1. Printhead
MACH4
Printing method Thermal transfer / Thermal direct
Print resolution dpi 203 300 600
Print speed up to mm/s 200 200 100
Print width mm 104 105.6 105.6
2. Material
Labels, continous rolls or fan-folded thermal and standard paper, cardboard, textile, plastic foils PE, PP, PVC, PA, PI
Material thickness mm / weight g/m
2
0.055 - 0.8 / 60 - 200
Label width
1)
mm 6 - 116
Width of carrier or of continuous material mm 25 - 120 / from 0.4 mm Material thickness 5 - 120
Label height
1)
mm 5 - 1000
Label height when dispensing
1)
mm 20 - 200
Material height when cutting
1)
mm 12 - 1000
Media roll: Total diameter up to mm 210
Core diameter mm 38 - 100
Winding direction outside our inside
3. Ribbon
Ink outside our inside
Roll diameter up to mm 72
Core diameter mm 25
Ribbon length variable up to m 360
Width up to mm 114
5. Dimensions printer
Height x Depth x Width mm 312 x 435 x 240
Weight kg 6
6. Label sensor
See-trough sensor for label edge or punching mark and end of material
Position
centered or shifted 10 mm to the left
Reflective sensor for label edge, punching or centered printing mark
Position
adjustable 56 mm to the left / 10 mm to the right
7. Electronics
Processor high speed 32 Bit ColdFire/clock frequency MHz
266
(RAM) MB 64
Memory IFFS MB Flash 8
Slot for memory CompactFlash-card Type I
Slot for memory card Cardbus / PC-Card Type II
Real time clock, print-ad out of time and date
8. Operation panel
Buttons illuminated, depending on mode of operation Pause, Feed, Cancel, Menue, Enter, 4 x Cursor
LCD graphic display Width x Height in mm 60 x 40
lines/characters 4 / about 20
9. Interfaces
Parallel Centronics bi-directional acc. IEEE 1284
Serial RS 232 C 1.200 up to 230.400 Baud/8 Bit
USB 2.0 High Speed Slave for PC-connection
Ethernet 10/100 Base T, LPD, RawIP-Printing,
ftp-Printing, DHCP, HTTP, FTP, SMTP, SNMP,
TIME, Zeroconf, mDNS, SOAP
WLAN card 802.11b/g WEP/WPA PSK (TKIP)
USB Master for external operation panel,
keyboard and scanner 2x
Standard Option
1)
Depending on label size, material and adhesive limitations are possible.
Critical material or applications have to be testet and cleared.
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